MANUFACTURING OF A FAMILY OF WOOD COMPOSITES WITH SOY FLOUR SUBSTITUTED ADHESIVES

The proposed research will attempt to understand the interaction among soy flour, MDI, and water during hot pressing wood strands. We have been able to substitute about 12% soy flour in MDI resin but deterioration in wet properties have limited our ability to reach a higher substitution level. An understanding of this fundamental interaction is needed if we are to increase our substitution level to the >20% target requested by industry.This research will also strive to substitute MDI with soy flour so as to a) reduce cost b) maintain or improve performanceand c) increase sustainability